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QFP devices of different materials on the solder joint reliability of lead Finite Element Analysis

Wires, and it has the advantage of high strength, can ensure the reliability of the circuit, but the poor thermal conductivity, and the price is high cost; alloy and the mechanical strength of a 42 linear expansion coefficient and Kovar similar, but the electrical and thermal conductivity somewhat less, the price is also higher; copper alloy with good thermal conductivity, process performance, low price, but the intensity ratio can be one of 42 cutting low alloy and alloy 【13j, we can see that each of the three excellent lead material shortcomings. In actual production, according to the different components of the structure and needs of different uses, the choice of materials with different properties of the lead is to ensure the QFP device performance and quality of the key factors. Calculated by simulating the material properties of several common characteristics of lead, the results of the matching and even lead QFP QFP device structure design, with a theoretical reference for reference. 3 Conclusions (1) QFP device stress concentration significantly after welding, weld the inner cusp is that the stress concentration area, and compared to other parts of the solder joint, where the most likely to produce damage. Loaded with cyclic temperature loads, joints with the superposition of residual stress. (2) In the case of plastic package carrier to compare a 42-alloy, copper alloy, and Kovar leads of three materials, a 42-lead alloy solder joint strain and stress generated by the minimum, resulting in the possibility of damage to the smallest spot. (3) The residual stress of copper alloy lead solder alloy for a slightly larger than the Kovar alloy solder joint 42 and the residual stress. Cheaper because the price of copper alloy, so the design and production of components, no special performance requirements of the situation, can replace the alloy with a copper alloy 42 and Kovar alloy as the lead material. References: [1] of fresh fly. The evolution of chip packaging technology [J]. Special equipment for the electronics industry, 2004 (4) :9-11, 76. [2] Kai Liu, Qi Liang,[link widoczny dla zalogowanych], Xie Chunxiao. Overview of IC lead frame materials [J]. Heat Treatment, 2006,21 (2) :21-24. [3] Liu Ruiqing, Cai Wei, Xiaojuan, et al. Copper Alloy Lead Frame Materials Research and Development [J]. Jiangxi Metallurgy, 2003,23 (6): 8l a 83. [4] Ma Xin, Qian Yi-yu, Liu hair. Numerical simulation of stress-strain field in the application of micro-assembly solder joint [J]. Electronics Process Technology, 2001,22 (2) :51-55. [5] Wu Yuxiu, TRANSACTIONS, Hu Yongfang. Size of cPGA airfoil lead solder joint reliability of lead [J]. Welding Journal,[link widoczny dla zalogowanych], 2005 , 26 (10) :105-108. [6] Geng Zhao new,[link widoczny dla zalogowanych], Yang Yuping. CBGA components of the 2D-Plone42 thermal deformation model of finite element analysis [J]. Capital Normal University (Natural Science), 2003.24 (2) :29-32. [7] Kan former Warsaw, Tan Long Jian, ZHANG Juan, et al. Advanced engineering application of ANSYS and Secondary Development [M]. Beijing: Electronic Industry Press,[link widoczny dla zalogowanych], 2006. [8] Hu Yongfang, TRANSACTIONS, THE CHINA. CBGA solder joint thermal cycle loading of different sizes under the stress and strain of the finite element simulation [J]. Welding Journal,[link widoczny dla zalogowanych], 2005,26 (10) :97-100. [9] the king, CHEN Xun, Chu Weihua. QFP solder joint shape prediction and reliability analysis [J]. Strength and the environment, 2OO4, 31 (1) :40-45. [1O] in North Korea clear. Lead frame with high strength and high conductivity copper alloys [J ]. Electrical Engineering Materials, 2005 (2) :33-37. [11] Zhao Xie group. Copper alloy lead frame material progress of the research and development [J]. Metals, 2003,27 (6) :776-781. [12] MaX. in, QionYiyu, YoshidaF. Finiteelementsimulationforme-ehonicalresponseofsurfacemountedsolderjointsunderdifferenttern-peraturecyclinglJJ. TransactionsofNonferrousMetalsSocietyofChina, 2001,11 (4) :471-474. [13] Yong-Xiang, Chen Zhu, Kuang Chun, et al. IC lead frame materials research with the status and trends of [J]. Materials Review, 2OO6, 2o (3) :122-125. About the author: Liang Zhang, male, born 1984, Master. Mainly engaged in welding and lead-free solder microelectronics research . Email: 1iong421064354 @ sina. c0rrI
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